Abstract:The AquaCrop model driven by water was used to study the simulated yield of full film double ridge sowing technology of corn in Dingxi City from 2016 to 2020, and I1 (bare land planting), I2 (narrow film planting with 45% mulching rate), I3 (wide film planting with 81.8% mulching rate) and I4 (full film double ridge planting with 100% mulching rate) were established respectively. The yield superiority and environmental adaptability of the four models were compared and analyzed, The relationship between sowing date, rainfall and soil moisture was obtained. The results of AquaCrop simulation showed that the model was suitable for simulating dry farming in Dingxi City. The Pearson correlation coefficient (r) between the output simulation value and the measured value of I4 model was greater than 0.91, the root mean square error (RMSE) was 0.1~0.24, the normalized root mean square error (CV(RMSE)) was 1.66%~2.10%, the Nash efficiency coefficient (EF) was greater than 0.9, and the consistency index (d) was greater than 0.94. The average temperature of the best sowing date in Dingxi City was stable at about 15℃ (about April 15-25 every year). The yield after sowing was the highest in this period. The yield, aboveground biomass and water productivity of the planting mode I4 model were 84.01%, 19.79% and 101.13% higher than that of the planting mode I1 model, 82.26%, 19.74% and 85.47% higher than that of the planting mode I2 model, and 63.26%, 14.80% and 82.63% higher than that of the planting mode I3 model, respectively. The total soil water content of I4 model in dry years was more than 90% higher than that of I1, I2 and I3 models, and more than 80% higher in wet years. From 2000 to 2020, the water consumption was higher than the effective rainfall for seven years, and the water consumption was lower than the effective rainfall for 13 years. The simulation results showed that the water consumption of the full film double ridge sowing technology was equal to the rainfall, and the soil water would not be overdrawn.